"Our social, nature and climate teams meet regularly and collaborate, but there is no cross-cutting strategy yet and we do ...
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: We present our recent progress in integrated silicon optical phased array (OPA), which demonstrates aliasing-free beam steering across a full 180° field of view, low side-lobe levels -19 dB ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results