Abstract: Innovative thermal management solutions are required to maintain a lower operating temperature of current lidless packages of AI chips. This study systematically investigates direct-on-chip ...
Researchers at the University of Illinois Urbana-Champaign have developed a cold plate design workflow that pairs topology optimization (TO) with electrochemical additive manufacturing (ECAM) to ...
The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...
Abstract: To address the issue of excessive temperature in SiC power module, this work proposes a dual-side cooling (DSC) package structure with highly thermally conductive graphitemolybdenum spacer.
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