System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

Magnum Venus Products, a global manufacturer of fluid movement and production solutions for industrial applications, is launching a new process for closed molding to increase part production by ...

The use of fuel cells has changed the way global energy is used. Direct methanol fuel cell (DMFC) and proton exchange membrane fuel cell (PEMFC) will become the core of power generators in the future, ...