The soldering process has always presented challenges in large scale PCB applications. Perhaps the largest challenge is the risk that the high temperatures of tooling and soldering could cause damage ...
The ROHS (restriction-of-hazardous-substances) directive, which the EU (European Union) enacted in 2006, aims to prevent environmental damage by restricting the use of lead, mercury, cadmium, ...
MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages, that also features side-wettable flanks to support automated ...
These miniaturised logic ICs are essential for space constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, ...
The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications ...
Nexperia has brought out a portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB ...
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