The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks.

Thermally conductive thermoplastics for heat sinks and thermal management dissipate the same amount of heat as aluminum but are up to 50% lighter. They also have no antenna effect (no amplification of ...

When choosing an effective heat sink, engineers usually consider its price, size, weight, performance and other features. But equal care should be given to deciding how the heat sink will be attached ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

http://www.coolinnovations.comAs dissipated heat loads continue to rise, engineers seek increasingly efficient heat sinks. The efficiency of various heat sink ...

As the heat density increases at the die level of more powerful semiconductor devices, there becomes a greater need for new and innovative cooling solutions. Standard Aluminum extrusions and bonded ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...