What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, ...

Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

Mirtec, the South Korea–based manufacturer of optical inspection equipment, will showcase its latest semiconductor inspection system at Semicon West 2025 in Phoenix next month, as competition ...

The company's UCIe-3D 5nm bottom die supports TSVs to supply power and ground to the 3nm top die. Its 3DIO portfolio also includes a proprietary design flow and methodology for fast and efficient ...

Cadence Design Systems, Inc.’s CDNS has maintained a long-standing partnership with Taiwan Semiconductor Manufacturing Company (“TSMC”), which continues to strengthen over time. A couple of years back ...